Honeywell has announced the availability of a Thermal Interface Materials (TIM) solution to help smartphone manufacturers and designers effectively manage heat dissipation in their phones.
The worldwide smartphone market is expected to reach more than 1.9 billion units by 2020, according to a study from IDC Research. Smartphones and tablets now make up more than 80 per cent of connected devices in the Middle East and Africa (Smartphones Analysis Report 2017 by IHS Markit).
In addition, data needs are growing at unprecedented rates. To meet this challenge, the smartphone industry is leveraging technology that enables phones to provide optimal processing performance without overheating.
Honeywell’s TIM technology is based on phase change materials (PCMs). The technology transfers thermal energy from phone chips to a heat sink or spreader, where it is dissipated into the surrounding environment. This functionality keeps the chips cool, so the phone can perform reliably even during the most data-intense processes or during heat spikes. Honeywell’s solution is available worldwide and is already being used by some of the largest smartphone makers to upgrade the thermal designs of their latest phone models.
‘Honeywell’s innovative TIM technology provides customers with the ideal solution to optimise their phones’ performances,’ said Olivier Biebuyck, Vice President and General Manager of Honeywell Electronic Materials. ‘The Middle East region has some of the highest smartphone penetration rates in the world, particularly in the UAE and KSA.
‘As demand for smartphones grows around the region and globally, these breakthrough designs help provide optimal user experience throughout the entire lifecycle of their devices. Middle East smartphone users could increasingly see Honeywell materials protect their phones from overheating and ensure more reliable performance.’
Honeywell supplies microelectronic polymers, electronic chemicals, and other advanced materials along with an extensive set of product offerings under its metals business segment, including physical vapor deposition (PVD) targets and coil sets, precious metal thermocouples, and low alpha emissivity plating anodes and advanced heat spreader materials used during back-end packaging processes for thermal management and electrical interconnect.
For more information about Honeywell’s thermal management materials, or to contact a Honeywell representative, visit www.electronicmaterials.com.
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